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1

Multilayered Electromagnetic Interference Shielding Structures for Suppressing Magnetic Field Coupling

Watanabe, Atom O., Raj, Pulugurtha Markondeya, Wong, Denny, Mullapudi, Ravi, Tummala, Rao

Journal:

Journal of Electronic Materials

Année:

2018

Langue:

english

Fichier:

PDF, 2.61 MB

english, 2018

2

Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling

Kim, Youngwoo, Cho, Jonghyun, Cho, Kyungjun, Park, Junyong, Kim, Subin, Kim, Dong-Hyun, Park, Gapyeol, Sitaraman, Srikrishna, Raj, Pulugurtha Markondeya, Tummala, Rao R., Kim, Joungho

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2017

Langue:

english

Fichier:

PDF, 5.22 MB

english, 2017

3

Multichip Embedding Technology Using Fine-Pitch Cu–Cu Interconnections

Khan, Sadia A., Choudhury, Abhishek, Kumbhat, Nitesh, Pulugurtha, Markondeya Raj, Sundaram, Venky, Meyer-Berg, Georg, Tummala, Rao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2013

4

Coelectrodeposited Solder Composite Films for Advanced Thermal Interface Materials

Raj, Pulugurtha Markondeya, Gangidi, Prashant Reddy, Nataraj, Nikhilesh, Kumbhat, Nitesh, Jha, Gopal C., Tummala, Rao, Brese, Nathaniel

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 2.99 MB

english, 2013

5

Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits

Kumbhat, Nitesh, Choudhury, Abhishek, Mehrotra, Gaurav, Raj, Pulugurtha Markondeya, Sundaram, Venky, Tummala, Rao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2012

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2012

6

All-Solution Thin-film Capacitors and Their Deposition in Trench and Through-Via Structures

Wang, Yushu, Xiang, Shu, Pulugurtha, Markondeya Raj, Sharma, Himani, Williams, Byron, Tummala, Rao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 1.61 MB

english, 2013

7

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Large low-CTE glass package-to-PCB interconnections with solder strain-relief using polymer collars

Menezes, Gary, Smet, Vanessa, Kobayashi, Makoto, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao

Année:

2014

Langue:

english

Fichier:

PDF, 2.14 MB

english, 2014

8

Magnetic and Dielectric Property Studies in Fe- and NiFe-Based Polymer Nanocomposites

Sharma, Himani, Jain, Shubham, Raj, Pulugurtha Markondeya, Murali, K. P., Tummala, Rao

Journal:

Journal of Electronic Materials

Année:

2015

Langue:

english

Fichier:

PDF, 1.28 MB

english, 2015

9

Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays

Xian Qin,, Raj, Pulugurtha Markondeya, Smet, Vanessa, Tummala, Rao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2015

Langue:

english

Fichier:

PDF, 2.73 MB

english, 2015

10

High- $k$ Thin-Film Capacitors With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications

Gandhi, Saumya, Pulugurtha, Markondeya Raj, Sharma, Himani, Chakraborti, Parthasarathi, Tummala, Rao R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2016

Langue:

english

Fichier:

PDF, 2.08 MB

english, 2016

11

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Design and Demonstration of Ultra-Thin Glass 3D IPD Diplexers

Wu, Zihan, Min, Junki, Kim, Minsuk, Pulugurtha, Markondeya Raj, Sundaram, Venky, Tummala, Rao R.

Année:

2016

Langue:

english

Fichier:

PDF, 679 KB

english, 2016

12

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages

Kim, Min Suk, Pulugurtha, Markondeya Raj, Wu, Zihan, Sundaram, Venky, Tummala, Rao

Année:

2016

Langue:

english

Fichier:

PDF, 539 KB

english, 2016

13

[IEEE 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tampa, FL, USA (2017.3.26-2017.3.30)] 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections

Mohan, Kashyap, Shahane, Ninad, Raj, Pulugurtha Markondeya, Antoniou, Antonia, Smet, Vanessa, Tummala, Rao

Année:

2017

Langue:

english

Fichier:

PDF, 2.07 MB

english, 2017

14

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Wu, Zihan, Min, Junki, Smet, Vanessa, Raj Pulugurtha, Markondeya, Sundaram, Venky, Tummala, Rao R.

Journal:

Journal of Electronic Packaging

Année:

2017

Langue:

english

Fichier:

PDF, 6.09 MB

english, 2017

15

Miniaturized and high-performance RF packages with ultra-thin glass substrates

Kim, Min Suk, Pulugurtha, Markondeya Raj, Kim, Youngwoo, Park, Gapyeol, Cho, Kyungjun, Smet, Vanessa, Sundaram, Venky, Kim, Joungho, Tummala, Rao

Journal:

Microelectronics Journal

Année:

2018

Langue:

english

Fichier:

PDF, 2.60 MB

english, 2018

16

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - 3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas

Ali, Muhammad, Watanabe, Atom, Lin, Tong-Hong, Pulugurtha, Markondeya Raj, Tentzeris, Manos M., Tummala, Rao R.

Année:

2019

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2019

17

Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications

Watanabe, Atom O., Tehrani, Bijan K., Ogawa, Tomonori, Raj, Pulugurtha Markondeya, Tentzeris, Manos M., Tummala, Rao R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2020

Fichier:

PDF, 1.00 MB

2020

18

Vapor phase infiltration of aluminum oxide into benzocyclobutene-based polymer dielectrics to increase adhesion strength to thin film metal interconnects

Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Kondekar, Neha, Losego, Mark D., Tummala, Rao

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Année:

2020

Fichier:

PDF, 3.45 MB

2020

19

Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Lin, Tong-Hong, Kanno, Kimiyuki, Watanabe, Atom O., Raj, Pulugurtha Markondeya, Tummala, Rao, Swaminathan, Madhavan, Tentzeris, Emmanouil M.

Journal:

IEEE Antennas and Wireless Propagation Letters

Année:

2020

Fichier:

PDF, 626 KB

2020

20

Hydrothermal Barium Titanate Thin-Film Characteristics and their Suitability as Decoupling Capacitors

Pulugurtha Markondeya Raj, Baik-Woo Lee, Devarajan Balaraman, Nam-Kee Kang, Michael J. Lance, Harry Meyer, Rao R. Tummala

Journal:

Journal of the American Ceramic Society

Année:

2010

Langue:

english

Fichier:

PDF, 577 KB

english, 2010

21

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A new era in manufacturable, low-temperature and ultra-fine pitch Cu interconnections and assembly without solders

Smet, Vanessa, Kobayashi, Makoto, Wang, Tao, Raj, Pulugurtha Markondeya, Tummala, Rao

Année:

2014

Langue:

english

Fichier:

PDF, 2.21 MB

english, 2014

22

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Interconnection materials, processes and tools for fine-pitch panel assembly of ultra-thin glass substrates

Smet, Vanessa, Huang, Ting-Chia, Kawamoto, Satomi, Singh, Bhupender, Sundaram, Venky, Pulugurtha, Markondeya Raj, Tummala, Rao

Année:

2015

Langue:

english

Fichier:

PDF, 1.88 MB

english, 2015

23

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders

Shahane, Ninad, McCann, Scott, Ramos, Gustavo, Killian, Arnd, Taylor, Robin, Sundaram, Venky, Raj, Pulugurtha Markondeya, Smet, Vanessa, Tummala, Rao

Année:

2015

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2015

24

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages

Sitaraman, Srikrishna, Min, Junki, Pulugurtha, Markondeya Raj, Kim, Min Suk, Sundaram, Venky, Tummala, Rao

Année:

2015

Langue:

english

Fichier:

PDF, 892 KB

english, 2015

25

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - First demonstration of drop-test reliability of ultra-thin glass BGA packages directly assembled on boards for smartphone applications

Singh, Bhupender, Smet, Vanessa, Lee, Jaesik, Menezes, Gary, Kobayashi, Makoto, Raj, Pulugurtha Markondeya, Sundaram, Venky, Roggeman, Brian, Ray, Urmi, Radojcic, Riko, Tummala, Rao

Année:

2015

Langue:

english

Fichier:

PDF, 1.56 MB

english, 2015

26

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation

Kim, Min Suk, Cho, Sangbeom, Min, Junki, Pulugurtha, Markondeya Raj, Huang, Nathan, Sitaraman, Srikrishna, Sundaram, Venky, Velez, Mario, Ravindran, Arjun, Joshi, Yogendra, Tummala, Rao

Année:

2015

Langue:

english

Fichier:

PDF, 958 KB

english, 2015

27

Chemical synthesis of low-coercivity, silica/Co composites for high-frequency magnetic components

Sharma, Himani, Pulugurtha, Markondeya Raj, Tummala, Rao

Journal:

Materials Chemistry and Physics

Année:

2016

Langue:

english

Fichier:

PDF, 2.00 MB

english, 2016

28

XPS depth profiling and leakage properties of anodized titania dielectrics and their application in high-density capacitors

Chakraborti, Parthasarathi, Sharma, Himani, Pulugurtha, Markondeya Raj, Tummala, Rao

Journal:

Journal of Materials Science

Année:

2015

Langue:

english

Fichier:

PDF, 1.65 MB

english, 2015

29

Ultrathin, Substrate-Integrated, and Self-Healing Nanocapacitors With Low-Leakage Currents and High-Operating Frequencies

Chakraborti, Parthasarathi, Sharma, Himani, Pulugurtha, Markondeya Raj, Rataj, Kamil-Paul, Schnitter, Christopher, Neuhart, Nathan, Jain, Shubham, Gandhi, Saumya, Tummala, Rao R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2016

Langue:

english

Fichier:

PDF, 2.60 MB

english, 2016

30

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

Kim, Youngwoo, Cho, Jonghyun, Kim, Jonghoon J., Kim, Kiyeong, Cho, Kyungjun, Kim, Subin, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao, Kim, Joungho

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2016

Langue:

english

Fichier:

PDF, 2.42 MB

english, 2016

31

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Novel High-Temperature, High-Power Handling All-Cu Interconnections through Low-Temperature Sintering of Nanocopper Foams

Shahane, Ninad, Mohan, Kashyap, Behera, Rakesh, Antoniou, Antonia, Markondeya, Pulugurtha Raj, Smet, Vanessa, Tummala, Rao

Année:

2016

Langue:

english

Fichier:

PDF, 499 KB

english, 2016

32

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Demonstration of Next-Generation Au-Pd Surface Finish with Solder-Capped Cu Pillars for Ultra-Fine Pitch Applications

Huang, Ting-Chia, Smet, Vanessa, Raj, Pulugurtha Markondeya, Tummala, Rao R., Ramos, Gustavo, Kilian, Arnd, Taylor, Robin, Nichols, Rick

Année:

2016

Langue:

english

Fichier:

PDF, 1.07 MB

english, 2016

33

Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling

Kim, Youngwoo, Cho, Jonghyun, Kim, Jonghoon J., Cho, Kyungjun, Kim, Subin, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao R., Kim, Joungho

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2017

Langue:

english

Fichier:

PDF, 1.97 MB

english, 2017

34

Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

Sitaraman, Srikrishna, Sukumaran, Vijay, Pulugurtha, Markondeya Raj, Wu, Zihan, Suzuki, Yuya, Kim, Youngwoo, Sundaram, Venky, Kim, Joungho, Tummala, Rao R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2017

Langue:

english

Fichier:

PDF, 3.88 MB

english, 2017

35

Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties

Chakraborti, Parthasarathi, Sharma, Himani, Pulugurtha, Markondeya Raj, Gandhi, Saumya, Tummala, Rao R.

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2017

Langue:

english

Fichier:

PDF, 3.65 MB

english, 2017

36

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Infusing Inorganics into the Subsurface of Polymer Redistribution Layer Dielectrics for Improved Adhesion to Metals Interconnects

Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Leng, Collen Z., Smet, Vanessa, Losego, Mark D., Sundaram, Venky, Tummala, Rao

Année:

2017

Langue:

english

Fichier:

PDF, 458 KB

english, 2017

37

Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages

Kim, Min Suk, Pulugurtha, Markondeya Raj, Sundaram, Venky, Tummala, Rao R., Yun, Hobie

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2018

Langue:

english

Fichier:

PDF, 2.73 MB

english, 2018

38

[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Design and analysis of receiver channels of glass interposer for dual band Wi-Fi front end module (FEM)

Park, Gapyeol, Kim, Youngwoo, Cho, Kyungjun, Kim, Joungho, Kim, Minsuk, Raj, Pulugurtha Markondeya, Sundaram, Venky, Tummala, Rao

Année:

2017

Langue:

english

Fichier:

PDF, 657 KB

english, 2017

39

Ultra-High Density, Thin-Film Tantalum Capacitors with Improved Frequency Characteristics for MHz Switching Power Converters

Spurney, Robert Grant, Sharma, Himani, Pulugurtha, Markondeya Raj, Tummala, Rao, Lollis, Naomi, Weaver, Mitch, Gandhi, Saumya, Romig, Matt, Brumm, Holger

Journal:

Journal of Electronic Materials

Année:

2018

Langue:

english

Fichier:

PDF, 1.32 MB

english, 2018

40

Nanopackaging Pervades Future Electronic and Bioelectronic Systems [Guest Editorial]

Raj, Pulugurtha Markondeya

Journal:

IEEE Nanotechnology Magazine

Année:

2019

Langue:

english

Fichier:

PDF, 3.52 MB

english, 2019

41

[IEEE 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) - Portland, OR (2018.10.14-2018.10.17)] 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) - Nanostructures for Enabling Implantable Bioelectronic Systems

Raj, Pulugurtha Markondeya, Spurnevy, Robert Grant, Dwarakanath, Shreya, Mohanalingam, Kathaperumal, Tummala, Rao

Année:

2018

Langue:

english

Fichier:

PDF, 675 KB

english, 2018

42

Next-Generation Nanopackaging [Guest Editorial]

Raj, Pulugurtha Markondeya

Journal:

IEEE Nanotechnology Magazine

Année:

2018

Langue:

english

Fichier:

PDF, 342 KB

english, 2018

43

Low-Loss Impedance-Matched Sub-25 Î¼m Vias in 3D Millimeter-Wave Packages

Watanabe, Atom O., Ito, Hirokazu, Markondeya, Raj Pulugurtha, Tummala, Rao R., Swaminathan, Madhavan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2020

Fichier:

PDF, 5.38 MB

2020

44

[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Design and Measurement of a 28 GHz Glass Band Pass Filter based on Glass Interposers for 5G Applications

Park, Gapyeol, Cho, Kyungjun, Son, Kyungjune, Park, Hyunwook, Lho, Daehwan, Kim, Seongguk, Shin, Taein, Kim, Youngwoo, Kim, Joungho, Watanabe, Atom, Raj, Pulugurtha Markondeya, Sundaram, Venky, Tummal

Année:

2019

Fichier:

PDF, 1.66 MB

2019

45

Reliability of fine-pitch < 5 Î¼m diameter microvias for high-density interconnects

Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi, Raj, Pulugurtha Markondeya, Swaminathan, Madhavan, Tummala, Rao R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2020

Fichier:

PDF, 1.51 MB

2020

46

Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration

Wang, Yiteng, Watanabe, Atom O., Ogura, Nobuo, Raj, Pulugurtha Markondeya, Tummala, Rao

Journal:

Journal of Electronic Materials

Année:

2020

Fichier:

PDF, 1.09 MB

2020

47

Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias

Watanabe, Atom O., Lin, Tong-Hong, Ali, Muhammad, Wang, Yiteng, Smet, Vanessa, Raj, Pulugurtha Markondeya, Tentzeris, Manos M., Tummala, Rao R., Swaminathan, Madhavan

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2020

Fichier:

PDF, 6.19 MB

2020

48

Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure

Kim, Youngwoo, Park, Gapyeol, Cho, Kyungjun, Raj, Pulugurtha Markondeya, Tummala, Rao R., Kim, Joungho

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2020

Fichier:

PDF, 2.80 MB

2020